Manufacturing - Board Assembly
Call (508) 303-1305 for assistance or email mfg@datx.com
Our state-of-the-art surface mount process is designed for high component mix, batch production with quick changeovers. We are equipped to process conventional through hole and mixed assemblies as well.
Capabilities:
- Double sided SMT and mixed technology
- Fine pitch placement to 10 mil
- 0402 passives
- Ball Grid array placement and rework
- Through hole insertion (Auto & Semi-Auto)
- ECO Rework Capabilities
- Mechanical assembly
- Paste –in-hole- Reflow
- No clean flux
- Selective wave solder
- Closed loop Aqueous wash
- Field upgrade services
- SMT stencil design and procurement
- Design verification system (HALT/HASS)
- Functional test capabilities
- Design for Manufacturability services
- Device programming Capabilities
- Environmental and ESD controls Equipment
- Mydata MY-15 with line scan camera
- Mydata TP9 2U pick and place (2)
- Dek 260 Screen Printer
- Conceptronics HVA 70 convection oven
- Environmental stress process for design verification and production.
- Hollis Future I Wave Solder
- Treiber Aqueous cleaner
- Dynapert DD4500 Dip Inserter
- Autosplice automatic pin inserter
- Contact Systems component locators (3)
- Cyberoptics LSM (paste height SPC)
- Air Vac DRS 22 Rework station
- Tescon MDA analyzer
|
 |
|
